集团简介
三和国际集团
是一家有信仰、有使命、有梦想的儒商企业
Hyper very low profile copper foil with excellent signal integrity (SI).
Suitable for low Dk/Df prepreg as board material with good bonding strength.
| Product | Roughness,Rz (prepreg side) |
Thickness (μm) |
Application | Status |
| BR-LLX (VLP) |
≤3.0 μm | 12/18/35 | Sensor Chip |
Mass production |
| BR-2LX (HVLP1) |
≤2.0 μm | Computer | ||
| BR-3LX (HVLP2) |
≤1.5 μm | AI PC/ Server |
||
| BR-5LX (HVLP4) |
≤0.8 μm | 18/35 | AI Server | Under development |
Transmission Loss
VLP series has better signal integrity (SI) than RT series.


