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RTF&HVLP精密铜箔领先品牌

BR-LLX/BR-2LX/BR-3LX/BR-5LX

 

Double shiny side copper foil for HF application 

 

Product Characteristic 

Hyper very low profile copper foil with excellent signal integrity (SI). 
Suitable for low Dk/Df prepreg as board material with good bonding strength.

  

Product Roughness,Rz
(prepreg side)
Thickness
(μm)
Application Status
BR-LLX
(VLP)
≤3.0 μm 12/18/35 Sensor
Chip
Mass
production
BR-2LX
(HVLP1)
≤2.0 μm Computer
BR-3LX
(HVLP2)
≤1.5 μm AI PC/
Server
BR-5LX
(HVLP4)
≤0.8 μm 18/35 AI Server Under
development

  

Transmission Loss

VLP series has better signal integrity (SI) than RT series.

 

 

High Performance Copper Foil 

 

 

High Frequency Solution  

According to different end user, LCYT provides suitable solution to the customers.