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Youlchon Conductive Bonding film
YCB-800C/YCB-900R
产品特性
优异的导电特性，接地阻值低
对各种基材有很高的附着力
高耐热性
应客户的需求，制造个性化的厚度
技术参数
Technical Data Sheet
Structure
| Properties | Typical Value | ||||
| unit | YCB-800C | YCB-900R | |||
| Thickness | Conductive Adhesive Layer | μm | 60±6 | 60±6 | |
| Protect film | μm | 50±5 | 50±5 (White PET) |
||
| Shield effect | dB | 64 | 67 | ||
| Surface Resistance | mΩ/□ | <300 | <300 | ||
| Peel Strength | Ni-SUS | Polyimide(PI) | Kgf/cm | ≥1.2 | ≥1.5 |
| Copper(Gold plated) | Kgf/cm | ≥1.0 | ≥1.2 | ||
| Conductivity(GND φ1.0mm) | Ω | 0.15 | 0.12 | ||
| Solder Resistance(288℃ solder floating 10sec) | - | Pass | Pass | ||
| sotropic Conductive Adhesive Layer |
Modified Resin Based (with metal filer) |
60μm |
| Protection Film | Release PET | 50μm |
