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Youlchon Nonconductive Bonding film
YBS-000N
产品特性
粘附力强(FR-4,PI,SUS,Cu,AL,Pd等金属)，适用于无铅回流焊接工艺
树脂流动性好，填充能力好
树脂拥有快速固化能力，提升了固化效率
技术参数
Technical Data Sheet
Structure
| Properties | Typical Value | ||||
| Unit | YBS-025N | YBS-035N | YBS-050N | ||
| Thickness | Adhesive Layer | μm | 25±5 | 35±5 | 50±5 |
| Protect film | μm | 50±5 | 50±5 | 50±5 | |
| Peel Strength | Polyimide (Pl) | Kgf/cm | >1.0 | >1.2 | >1.5 |
| FR-4 | Kgf/cm | >1.0 | >1.2 | >1.5 | |
| SUS | Kgf/cm | >1.0 | >1.2 | >1.5 | |
| Solder Resistance(288°c solder floating 10sec) | — | Pass | Pass | Pass | |
| Adhesive Layer | Modified Resin Based | 25/35/50μm |
| Protection Film | Release PET | 5 0 μm |
