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高频超低损耗（DF=0.0004）FCCL定制化解决方案

6G用途高频覆铜板PILLAR PC-CLADTM

高频超低损耗（DF=0.0004）2.04W/m.k覆铜板

RTF&HVLP精密铜箔领先品牌

半高频覆铜板低成本定制化方案商

韩国领先的PCB/FPC阻焊油墨品牌

6G用途高频覆铜板PILLAR PC-CLADTM

F260AS和F300AS是具有低热膨胀系数(CTE)的氟碳树脂基板适用于多层PCB，以确保汽车级可靠性。

Reliability

· Through-hole (TH) connection reliability

Temperature: -40°C (30 min) ⇔ 125°C (30 min)
Number of cycles: 3,000
Drill bit size: φ0.15 mm to φ0.4 mm
Copper foil thickness: 18 μm Plating thickness: 20 μm

· Insulation reliability

Pretreatment: Reflow at 260°C × 2
Temperature/Humidity: 85°C/85%RH
Applied voltage: 16 VDC
Testing time: 1,000 hours Copper foil thickness: 18 μm
Plating thickness: 20 μm

F260AS和F300AS是适用于多层PCB的低CTE、低形变、低损耗基板。

Electrical characteristics (Evaluation results when dielectric thickness is 0.127 mm)

Prototype example of fluorocarbon resin build-up PCBs

我们通过研究低介电常数和低损耗因子的薄热固性粘合膜特性，开发了以前难以生产的用于积层多层PCB的氟碳树脂基板。

Features

Can use popular press equipment (200°C) Hybrid multi-layer PCBs laminated
with conventional FR4 PCBs Laser via that satisfies automotive-grade reliability
Transmission loss characteristics similar to those of fluorocarbon resin

通过应用由氟碳聚合物制成的任意层结构和堆积型PCB，实现了超低损耗，并且可以预期毫米波应用的性能将得到显著提高。

Main specifications of high-frequency substrates

NPC-F220A
Nominal dielectric thickness	Dielectric thickness [mm]	Dielectric constant [10GHz]	Dissipation factor [10GHz]	Coefficients of linear thermal expansion @ -40°C to 150°c [ppm/C]			Copper foil thickness [μm]	Product [mm]
0.127(C)	0.127	2.19	0.0007	x	y	z	18	340×510
0.254(C)	0.254	2.2	0.0007	28	26	202	35	340×510

NPC-H220A
Nominal dielectric thickness [mm]	Dielectric thickness [mm]	Dielectric constant [10GHz]	Dissipation factor [10GHz]	Coefficients of linear thermal expansion			Copper foil thickness [μm]	Product size [mm]
Nominal dielectric thickness [mm]	Dielectric thickness [mm]	Dielectric constant [10GHz]	Dissipation factor [10GHz]	X	Z	Y	Copper foil thickness [μm]	Product size [mm]
0.4	0.37	2.16	0.0004	_	_	_	18 35	300×500 340×510 600×500
0.5	0.46	2.19	0.0006
0.6	0.56	2.18	0.0006
0.8	0.8	2.16	0.0005					300×500 600×500
1.0	0.98	2.17	0.0005
1.2	1.21	2.18	0.0005
1.6	1.59	2.17	0.0005
3.2	3.19	2.16	0.0009

NPC-F260A
Nominal dielectric thickness [mm]	Dielectric thickness [mm]	Dielectric constant [10GHz]	Dissipation factor [10GHz]	Coefficients of linear thermal expansion			Copper foil thickness [μm]	Product size [mm]
Nominal dielectric thickness [mm]	Dielectric thickness [mm]	Dielectric constant [10GHz]	Dissipation factor [10GHz]	X	Z	Y	Copper foil thickness [μm]	Product size [mm]
0.1	0.08	2.59	0.0018	17	12	175	18 35	340×510 680×500
0.2	0.155	2.59	0.0017
0.4	0.4	2.55	0.0015
0.5	0.49	2.58	0.0015
0.6	0.55	2.6	0.0017
0.8	0.74	2.53	0.0018
1.0	0.96	2.58	0.0014
1.2	1.15	2.61	0.0014
1.6	1.53	2.56	0.0015
3.2	3.12	2.59	0.0028

Main specifications of newly developed materials for multi-layer PCBs

NPC-F260AS
Nominal dielectric thickness [mm]*1	Dielectric thickness [mm]	Dielectric constant [10GHz]	Dissipation factor [10GHz]	Coefficients of linear thermal expansion			Copper foil thickness [μm]	Product size [mm]
Nominal dielectric thickness [mm]*1	Dielectric thickness [mm]	Dielectric constant [10GHz]	Dissipation factor [10GHz]	X	Z	Y	Copper foil thickness [μm]	Product size [mm]
0.075(C)	0.075	2.85	0.0017	10	13	90	12 18	340×510 533×610 （21×24 inches）
0.1(C)	0.1	2.82	0.0016	15	15	93
0.127(C)	0.127	2.79	0.0011	18	17	95

NPC-F300AS
Nominal dielectric thickness [mm]*1	Dielectric thickness [mm]	Dielectric constant [10GHz]	Dissipation factor [10GHz]	Coefficients of linear thermal expansion			Copper foil thickness [μm]	Product size [mm]
Nominal dielectric thickness [mm]*1	Dielectric thickness [mm]	Dielectric constant [10GHz]	Dissipation factor [10GHz]	X	Z	Y	Copper foil thickness [μm]	Product size [mm]
0.075(C)	0.075	3.02	0.0015	8	11	75	12 18	340×510 533×610 （21×24 inches）
0.1(C)	0.1	3.02	0.0013	10	11	48
0.127(C)	0.127	3.00	0.0012	13	12	41

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高频超低损耗（DF=0.0004）FCCL定制化解决方案 6G用途高频覆铜板PILLAR PC-CLADTM 高频超低损耗（DF=0.0004）2.04W/m.k覆铜板 RTF&HVLP精密铜箔领先品牌半高频覆铜板低成本定制化方案商韩国领先的PCB/FPC阻焊油墨品牌